Wednesday, 28 June 2006 - 10:30 AM
Federal Room B (Capital Hilton)

Development of a low-k material from renewable resources

Mingjiang Zhan, Chang K. Hong, and Richard P. Wool. University of Delaware, Newark, DE

The development of low dielectric constant (low-k) materials is considered to be one of the most important topics in modern high-speed microelectronics. Some of the biggest drawbacks to use the current low-k materials are cost and non-sustainability. A new bio-based composite was developed from soybean oil and keratin fibers which is suitable for electronic applications. The composite is attractive from both economic and environmental perspectives and can be a substitute for petroleum-based composite materials. The natural product components can increase the biodegradability and are more environmentally friendly than current low-k materials. Keratin fibers are hollow, light and tough materials which innately contain a significant volume of air and are compatible with several modified soybean resins. Due to the retained air, the dielectric constant can be as low as 2.0-2.7, depending on the keratin fiber fraction. The k values are lower than conventional semiconductor insulators, such as silicon dioxide, polyimides and other dielectric materials. In addition to lowering the dielectric constant, the addition of keratin fibers significantly improved mechanical properties, such as fracture toughness, flexural properties and storage modulus. By optimization of the resin structure and fiber selection, it is possible that the thermal and mechanical stability will be improved considerably.

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