Min Yan, Ahmet Gün Erlat, Larry Turner, Brian Scherer, Cheryl Jones, Lifeng Zhang, Paul A. McConnelee, Anil Duggal, Thomas Feist General Electric Global Research Center, Schenectady, New York, USA
Abstract GE Global Research (GEGR) has developed novel ultrahigh barrier plastic films that can be used as substrates for organic electronic devices. The substrate is comprised of a high-heat polycarbonate substrate film and a unique transparent coating package that provides an ultrahigh barrier to moisture and oxygen and chemical resistance to solvents used in device fabrication. We will present recent progress made at GEGR towards achieving the ultra-high barrier substrate, both in batch mode and in roll-to-roll mode.
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Back to The 34th Northeast Regional Meeting (October 5-7 2006)