Friday, 6 October 2006 - 2:55 PM
North Riverside (Binghamton Regency Hotel and Conference Center)
318

Ultrahigh Barrier Substrates for Organic Electronics

Thomas P. Feist, General Electric Global Research, Niskayuna, NY

Progress on Flexible Substrate for Organic Electronics

Min Yan, Ahmet Gün Erlat, Larry Turner, Brian Scherer, Cheryl Jones, Lifeng Zhang, Paul A. McConnelee, Anil Duggal, Thomas Feist General Electric Global Research Center, Schenectady, New York, USA

Abstract GE Global Research (GEGR) has developed novel ultrahigh barrier plastic films that can be used as substrates for organic electronic devices. The substrate is comprised of a high-heat polycarbonate substrate film and a unique transparent coating package that provides an ultrahigh barrier to moisture and oxygen and chemical resistance to solvents used in device fabrication. We will present recent progress made at GEGR towards achieving the ultra-high barrier substrate, both in batch mode and in roll-to-roll mode.


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