During the past few years, Flexible Printed Circuit (FPC) manufacturing has undergone a tremendous growth rate. Initially focused in Japan at some of the largest printed circuit board producers in the world, FPC manufacturing is now spreading throughout the rest of Asia. Although the largest segment of FPC production consists of single-sided and double-sided products, significant growth continues toward multilayer and rigid-flex products. By far the dominant application for FPCs is in consumer-driven electronic devices including cell phones, notebook computers, and large format flat panel displays. In response to this growth opportunity we have developed and optimized a direct metallization process utilizing a carbon nanoparticle technology targeted to FPC manufacturing. This technology has the advantages of process automation, chemical compatibility with FPC resin systems, less maintenance requirements, lower operating costs, and a more environmentally friendly process than conventional electroless copper and alternative direct metallization technologies. In this paper we will discuss the market, applications, and the novel chemistry characterized by the use of carbon nanoparticles specific to FPC manufacturing.