Polytetrafluoroethylene (PTFE) or Teflon has a very low coefficient of friction approximately 0.1~0.2. It also has excellent protection properties from moisture that affect the life of microelectronics as well as a thermal barrier from heat. The measurement and analysis of the mechanical characterization of Teflon would give a good insight into its behavior and better usage as a structural material or as a micro-encapsulation for electronics packaging. One purpose of this study is to establish the correlation between the mechanical behaviors and chemical structures of different types of flouropolymers. In particular, the optimization of test specimen designs will be achieved using a finite-element method in order to ensure fracturing occurring within the points of interest. The failures that occur in Teflon are further examined using a scanning electron microscope (SEM). The origin for the failures and crack propagations will provide additional information that is vital to material integrity for prolonged usage. The modeling of time-dependent nature using mechanical analogs will also be explored to have a predictive capability under a constant stress or a constant strain condition over a long period of time.