Roll-to-roll electronics manufacturing will eventually lead to continuous production of high quality, flexible, thin film devices with a significant cost reduction. This revolutionary approach will enable both ubiquitous and disposable electronic devices. As part of setting up the Center of Advanced Microelectronics Manufacturing, we fabricated aluminum circuit patterns on poly(ethyleneterephthalate) (PET) substrates by adapting conventional batch processes. RHEM Shipley SPR 220 and LC-100 positive photo resists were coated to 1.5 to 5.0 μm thicknesses on PET substrates, with or without a sputtered (< 1 μm thick) aluminum conducting layer, using both spin coating of single pieces or web die-slot coating of PET rolls as long as 1000 feet. Die-slot coating was performed at Frontier Industrial in Towanda, PA. The wavelength of exposure for these resists was 365 nm. The exposure energy was varied as an experimental variable. Aqueous KOH or NaOH solutions were used for resist development. The resist stripping process was evaluated by using aqueous alkaline solutions or 1-methyl-2-pyrrolidinone. The smallest feature size produced on unsupported PET substrates was 3 μm lines and spaces. Ultimately these processes will be scaled-up for preliminary roll-to-roll fabrication in support of testing a web based photolithography tool at the Azores Corporation in Wilmington, MA.