Conductive adhesives, a potential replacement for lead-based solder alloys in electronics packaging are composites of adhesive resin and metal fillers. The adhesives currently being used contain micro-sized silver flakes (sizes on the order of 50 microns) and loaded up to 85% in the resin. This high loading and particle size of the metal filler causes some reliability issues (such as poor mechanical strength and voiding when filling smaller holes) and also prevents certain use in high current-density applications. In this work, nano-meter sized particles (< 100 nm) are being studied in an effort to reduce the dependency upon the conventional micro-sized silver flakes used in conductive adhesive formulations. A major potential advantage of using nano-meter sized particles is that they need not be in contact with each other because the conduction mechanism is by electron tunneling and percolation. However, the dispersion of these nano particles in the resin plays a crucial role in determining the properties as they tend to form agglomerates because of their high surface energy. Different low boiling solvents (Isopropyl alcohol, ethyl alcohol) are used to predisperse the nano particles to help prevent them from forming agglomerates and their compatibility with a test material (BMI acrylic based resin) is studied. An effort is made to disperse mixture of silver flakes and nano particles at different ratios (90:10, 80:20, 70:30, and others) in the test material to study the electrical and thermal properties.