To demonstrate RTR process feasibility in the manufacture of flexible electronics, the Center for Advanced Microelectronics Manufacturing (CAMM) has been established at Binghamton University in partnership with Endicott Interconnect Technologies (EIT) and Cornell University. The CAMM objective is to ascertain processes capable of producing low cost, low volume test bed products using currently available tools (Vacuum Deposition, Photolithography, In-line Defect Inspection etc.). The CAMM will perform research in RTR processing that will aid development of emerging applications such as low-cost RFID tags, low-cost sensors, large-area OLED lighting, and other applications. In a RTR based photolithography system, the key performance criteria are high yield, good throughput with high image resolution and precise layer-to-layer alignment. The web based photolithography tool would pattern circuitry on individual layers and also ensure accurate subsequent layer registration by step-and-repeat technology. A wide array of materials like heat-stabilized polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Kapton, and other polymer materials along with glass would be tested as substrates to pattern circuits. The system is designed for imaging 18" x 24" 457 mm x 610 mm) area of substrate material with thicknesses from 100 to 200 microns with an image field stitching error of <= ± 1.0 micron. The web handling system will be able to accommodate rolls with a width of 610 mm and a length of 300 m.