Supercritical fluids exhibit gas-like mass transport properties yet have liquid-like solvation capabilities. Because of their high diffusivity and low viscosity, supercritical fluids can penetrate into small holes of porous materials to dissolve chemical compounds. Carbon dioxide is widely used for supercritical fluid applications because of its moderate critical constants (T_c = 31 ^oC and P_c = 73 atm), non-flammable nature, low cost, and availability in relatively pure form. Recent research has demonstrated that supercritical carbon dioxide (sc-CO₂) provides an effective medium for depositing advanced materials in small structures with high aspect ratios which is difficult to achieve by conventional methods. The experimental apparatus and conditions used in our laboratory for supercritical fluid deposition of metals and oxides in nanostructures of different substrates will be described. Potential applications of the supercritical fluid technology for semiconductor device processing will be discussed.